PRODUCT

Semiconductor Processing Equipment

Wax bonding, grinding, lapping, scribing, breaking. We provide tools for a variety of processes.
In addition, we can provide customized specifications or custom-designed machines tailored to whatever you may need.
To find out how much we can contribute to your manufacturing process, please do not hesitate to contact us.

Wafer Processing

Wax Bonding Machines

Mounts wafers onto a
ceramic plate by wax
Grinding Machines

Removes unnecessary
thickess from the wafer
Lapping Machines

Smoothly polishes the wafer to a precise
thickness

Die Preparation

Scribing Machines

Zero street witdth and a
smooth mirror-like cut
surface
Breaking Machines

The best tool for hard
substrate or compound
semiconductor
singulation

Counter Series, Labour-Saving Equipment/Jig Manufacturing

See more To the product form

Parts Manufacture

Cable Manufacturing

We design & produce various order-made wire harnesses and cables.

We also take OEM harness orders. (10+ semi-automatic crimping machines in possession.)

Free quotation. Single orders possible.

In addition to simple cables, we can also make cables with special feature specifications to your request.

Also, we can make electrical apparatus from combining cables with electrical components.

Can be made RoHS compliant.