TEC-7010SE

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• Featuring highly rigid spindles used in the work and wheel axes, this is a high performance grinding machine for the backgrinding of sapphire wafers.

  For use with 180～300mm ceramic plates to grind up to 8" wafers.

  Dimensions / Weight: 1500mm×1830mm×1900mm / 1500kg

  We can provide a variety of customisations. Contact us to find out more.