Grinding Machines


  • 研削装置:TEC-7010SE
  • Featuring highly rigid spindles used in the work and wheel axes, this is a high performance grinding machine for the backgrinding of sapphire wafers.

    For use with 180~300mm ceramic plates to grind up to 8" wafers.

    Dimensions / Weight: 1500mm×1830mm×1900mm / 1500kg

    We can provide a variety of customisations. Contact us to find out more.

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