Can polish two 240mm diameter ceramic plates simultaneously.
Our automatic measurement system measures the wafer thickness while polisihing to enable auto-processing to the specified thickness value.
Includes a facing unit as standard to eliminate the need to remove the lapping plate for facing.
Cassette to Cassette functionality available.
Dimensions / Weight: 1200mm×1800mm×1900mm / 2500kg
We can provide a variety of customisations. Contact us to find out more.