Lapping Machines


  • 研磨装置:TEC-8005CN
  • Can polish two 240mm diameter ceramic plates simultaneously.

    Our automatic measurement system measures the wafer thickness while polisihing to enable auto-processing to the specified thickness value.

    Includes a facing unit as standard to eliminate the need to remove the lapping plate for facing.

    Cassette to Cassette functionality available.

    Dimensions / Weight: 1200mm×1800mm×1900mm / 2500kg

    We can provide a variety of customisations. Contact us to find out more.

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