Features

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• Conditions Control

  Pressure, temperature and timing controls to match each wafer's characteristics and prevent damage to the device.

  Wax Thickness Uniformity

  An optimized heating and cooling system and a highly rigid structural design provides an even heat distribution and stable pressure application.

  A Variety of Specifications

  From manual machines with temperature and pressure controls, semi-automatic tools with wax dispensing, to fully automatic machines with cassette to cassette functionality.

  For a Variety of Materials

  Can be used with Silicon, Sapphire, SiC, GaAs, GaN, InP and more.