Wafer Breaking Machines
To learn more about the Breaking Process, Click Here
Highly Rigid Design
Enables the singulation of small chips, hard substrates, and compound semiconductors.
Break Recognition Function
Monitors the blade torque to minimize breaking misses.
Auto Alignment Function
Minimize matching errors with our improved Image Recognition System.
Comprehensive Breaking Controls
A variety of processing settings allow for reliable breaking condition control.
Double Arm Transport
Increased throughput by slashing frame handling time (TEC-1228AL).
Specifications to Match Your Production Needs
Choose from specifications such as cassette to cassette for mass production, or a Loader-less spec. for research and development, etc.
- Wafer Size
- Up to 4"
- Up to 6"
- Up to 8"
- Transport Arm
- Image Recognition
- Break Detection
- 1166mm ×862mm ×1963mm
- 1516mm ×862mm ×1506mm
- Processable materials
- Sapphire, GaN, GaAs, InP, Si, SiC, SiO2, Ceramic, LTCC, Glass
In addition to the above, we can provide a variety of customizations. Contact us to find out more.