PRODUCT

Wafer Breaking Machines

To learn more about the Breaking Process, Click Here

Features

  • Model
  • Highly Rigid Design

    Enables the singulation of small chips, hard substrates, and compound semiconductors.

    Break Recognition Function

    Monitors the blade torque to minimize breaking misses.

    Auto Alignment Function

    Minimize matching errors with our improved Image Recognition System.

    Comprehensive Breaking Controls

    A variety of processing settings allow for reliable breaking condition control.

    Double Arm Transport

    Increased throughput by slashing frame handling time (TEC-1228AL).

    Specifications to Match Your Production Needs

    Choose from specifications such as cassette to cassette for mass production, or a Loader-less spec. for research and development, etc.

To the product form

    Lineup

    Model:TEC-1018AR
    Model:TEC-1228AL
    Model:TBA
    Model
    TEC-1018AR
    TEC-1228AL
    TBA
    Wafer Size
    Up to 4"
    Up to 6"
    Up to 8"
    Transport Arm
    Single
    Double
    TBA
    Image Recognition
    Yes
    Yes
    TBA
    Break Detection
    Yes
    Yes
    TBA
    Dimensions
    1166mm ×862mm ×1963mm
    1516mm ×862mm ×1506mm
    TBA
    Weight
    550kg
    650kg
    TBA
    Processable materials
    Sapphire, GaN, GaAs, InP, Si, SiC, SiO2, Ceramic, LTCC, Glass

    In addition to the above, we can provide a variety of customizations. Contact us to find out more.

    To the product form
Copyright© 2018 KUMASAN MEDIX All rights reserved.