Semiconductor Processing Equipment
Semi-Automatic Scribing Machine for 4-Inch Wafers (Product Name: TEC-2005RM)
High speed, high quality! The definitive scribing machine.
- High Stability Design, High Throughput
- Independent processing, feed, and camera axes. Removes the vibration and blurring from high-speed use, and creates precise scribe lines. What's more, high speed settings are also available.
- Auto-Alignment Function
- Our original image recognition system allows for consolidated bar array recognition. In addition, Wafer Fragment Mode, which allows for single chip recognition, is also included.
- Air-Controlled Tool Pressure
- Unlike spring types, this allows for a fixed application of pressure that is not affected by the cutting depth which, along with the air suspension effect, means that tool jumping is extremely low.
- Linear Servo Motor Installation
- To decrease the vibration at the driving end, a linear servo motor has been installed which allows for a more accurate scribe.
- Diamond Scribe Tool
- A scribe tool born from superior diamond processing techniques and accumulated scribing techniques.
- Tool Setter
- A jig for saving preparation time and easily set the cutting point. Makes the operation more accurate and faster.
Size (Width x Depth x Height)
750mm×930mm×1560mm / 700kg
For any product questions/enquiries, please use the product form linked below.To the product form