Fully Automatic Breaking for up to 6-Inch Wafers (Product Name: TEC-1228AL)
The next generation breaking machine that supports 6-inch wafers.
- Standardized for 6-inch wafers
- Can also be used for wafers from 2 to 4 inches by changing the break blade and work table.
- Break detection function
- Eliminates secondary breaking errors.
- High efficiency wafer transport system
- Double-armed transport shortens wafer loading time.
- Accurate image recognition functions
- The clarity of the machine’s optical system reduces matching errors in image recognition.
- Top Face Light System
- Add effective top face lighting to deal with wafers that are difficult to see when only alluminated from the bottom face.
- Magnetic Hammer Unit
- This unit supports breaking that is difficult to accomplish with normal breaking operations.
Size (Width x Depth x Height)
1516mm×862mm×1506mm / 650kg
For any product questions/enquiries, please use the product form linked below.To the product form