Fully Automatic Breaking for up to 4-Inch Wafers (Product Name: TEC-1018AR)
Chip seperation, package seperation and more; this Fully Automatic Breaking Machine has a wide spectrum of functions.
- Fully automated operation with image recognition
- All wafer processing from the loading to unloading is carried out automatically based on image recognition.
- Automatic wafer alignment function
- Has an auto-alignment function, indispensable in fully automatic breaking.
- Break detection function
- Eliminates secondary breaking errors.
- High stability design
- Enables breaking wafers into very small chips.
- Large capacity loading/unloading system
- Cassettes that can hold up to 25 rings are available.
- Custom breaking blades
- We can customize the tip shape of your breaking blade.
- Top Face Light System
- Add effective top face lighting to deal with wafers that are difficult to see when only alluminated from the bottom face.
- Magnetic Hammer Unit
- This unit supports breaking that is difficult to accomplish with normal breaking operations.
Size (Width x Depth x Height)
1166m×862mm×1963mm / 550kg
For any product questions/enquiries, please use the product form linked below.To the product form