PRODUCT
Wafer Scribing Machines
To learn more about the Scribing Process, Click Here
Features
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Rigid Design, High Throughput
Independent scribing, table, and camera axes. Removes vibration and blurring from high-speed use, and creates precise scribe lines. High speed running actualized by a highly rigid structure.
Auto-Alignment Function
Our original image recognition system allows for collective bar array recognition. In addition, the Wafer Fragment Mode can be used for single chip recognition.
Air-Controlled Tool Pressure
Allows for a fixed application of pressure unaffected by the cutting depth (unlike spring type systems). Extremely low tool jumping due to the air suspension effect.
Linear Servo Motors
The installation of linear servo motors limits vibrations caused by axis movement, and allows for an even more precise scribing.
- Model
- TEC-2004TM
- TEC-2005RM
- TBA
- Wafer Size
- Up to 3"
- Up to 4"
- Up to 6"
- Type
- Manual
- Semi-automatic
- TBA
- Image Recognition
- No
- Yes
- TBA
- Dimensions
- 670mm ×850mm ×1300mm
- 750mm ×930mm ×1680mm
- TBA
- Weight
- 370kg
- 700kg
- TBA
Lineup
In addition to the above, we can provide a variety of customizations. Contact us to find out more.